Display device

ABSTRACT

Provided is a display device including a substrate, a transfer guiding mold provided on the substrate and including a plurality of openings, and a plurality of micro light emitting diodes (LEDs) provided on the substrate in the plurality of openings, wherein a height of the transfer guiding mold is less than twice a height of each of the plurality of micro LEDs.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to Korean Patent Application No.10-2019-0117488, filed on Sep. 24, 2019, in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein in itsentirety by reference.

BACKGROUND 1. Field

Example embodiments of the present disclosure relate to display devices,and more particularly, to display devices including a transfer guidingmold configured to increase the transfer efficiency of micro lightemitting diodes (LEDs).

2. Description of Related Art

Liquid crystal displays (LCDs) and organic light emitting diode (OLED)displays are widely used as display devices. Recently, a technology ofmanufacturing a high-resolution display device using a micro-lightemitting diode (LED) has attracted attention. To manufacture thehigh-resolution display device, a method of arranging LED chips withhigh efficiency manufactured in the form of a micro chip in properpositions of a substrate using a transfer process is used.

SUMMARY

One or more example embodiments provide display devices including atransfer guiding mold capable of increasing the transfer efficiency ofmicro light emitting diodes (LEDs).

Additional aspects will be set forth in part in the description whichfollows and, in part, will be apparent from the description, or may belearned by practice of the example embodiments.

According to an aspect of an example embodiment, there is provided adisplay device including a substrate, a transfer guiding mold providedon the substrate and including a plurality of openings, and a pluralityof micro light emitting diodes (LEDs) provided on the substrate in theplurality of openings, wherein a height of the transfer guiding mold isless than twice a height of each of the plurality of micro LEDs.

The display device may further include a plurality of driving circuitsconfigured to drive the plurality of micro LEDs, respectively, whereineach of the plurality of driving circuits are provided on the substrateand a portion of each of the plurality of driving circuits are exposedthrough the plurality of openings, respectively, of the transfer guidingmold.

The plurality of micro LEDs may be provided to be spaced apart from thetransfer guiding mold.

The display device may further include a first reflective layer providedon the transfer guiding mold between the plurality of micro LEDs.

The display device may further include a second reflective layerprovided on an inner wall of an opening provided in the transfer guidingmold.

The display device may further include a concave-convex structureprovided on an upper surface of the transfer guiding mold.

The display device may further include a plurality of unit pixels eachincluding a plurality of pixels of different colors.

Each of the plurality of unit pixels may include two or more pixels of asame color.

The plurality of pixels of different colors may include a plurality ofmicro LEDs configured to emit light of different wavelength bands.

The plurality of pixels of different colors may include a plurality ofmicro LEDs configured to emit light of a same wavelength band, and atleast some of the plurality of micro LEDs are provided with aphotoconversion material layer configured to convert a wavelength of anincidence light.

The display device may further include a barrier provided on an upperportion of the transfer guiding mold, the barrier being configured toreceive the photoconversion material layer.

The display device may further include a reflective layer provided on aninner wall of the barrier.

A height of the barrier may be greater than the height of the transferguiding mold.

According to another aspect of an example embodiment, there is provideda display device including a substrate, a transfer guiding mold providedon the substrate and including a plurality of openings, a plurality ofmicro light emitting diodes (LEDs) provided on the substrate in theplurality of openings, and a first reflective layer provided on thetransfer guiding mold between the plurality of micro LEDs.

The display device may further include a groove of a predetermined depthprovided in the transfer guiding mold between the plurality of microLEDs, wherein the first reflective layer may be provided on an innerwall of the groove.

The display device may further include a second reflective layerprovided on an inner wall of the plurality of openings provided in thetransfer guiding mold.

The display device may further include a concave-convex structureprovided on an upper surface of the transfer guiding mold.

The display device may further include a plurality of unit pixels eachincluding a plurality of pixels of different colors.

The plurality of pixels of different colors may include a plurality ofmicro LEDs configured to emit light of a same wavelength band, and atleast some of the plurality of micro LEDs are provided with aphotoconversion material layer configured to convert a wavelength of anincidence light.

The display device may further include a barrier provided on an upperportion of the transfer guiding mold, the barrier being configured toreceive the photoconversion material layer.

According to another aspect of an example embodiment, there is provideda display device including a substrate, a transfer guiding mold providedon the substrate and including a plurality of openings, and a pluralityof micro light emitting diodes (LEDs) provided on the substrate in theplurality of openings, a first reflective layer provided on the transferguiding mold between the plurality of micro LEDs, and wherein a secondreflective layer provided on an inner wall of each of the plurality ofopenings.

A height of the transfer guiding mold is 0.5 to 1.5 times a height ofeach of the plurality of micro LEDs.

The display device may further include a concave-convex structureprovided on an upper surface of the transfer guiding mold

BRIEF DESCRIPTION OF THE DRAWINGS

The above and/or other aspects, features, and advantages of exampleembodiments of the disclosure will be more apparent from the followingdescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a plan view schematically illustrating a display deviceaccording to an example embodiment;

FIG. 2 is a cross-sectional view taken along a line II-II′ of FIG. 1;

FIG. 3 illustrates a plan view illustrating a periphery of a micro lightemitting diode (LED) of FIG. 2;

FIG. 4 illustrates a display device according to another exampleembodiment;

FIG. 5 illustrates a display device according to another exampleembodiment;

FIG. 6 illustrates a plan view illustrating a periphery of a micro LEDof FIG. 5;

FIG. 7 illustrates a display device according to another exampleembodiment;

FIG. 8 illustrates a plan view illustrating a periphery of a micro LEDof FIG. 7;

FIG. 9 illustrates a display device according to another exampleembodiment;

FIG. 10 illustrates a display device according to another exampleembodiment;

FIG. 11 illustrates a display device according to another exampleembodiment; and

FIG. 12 is a plan view schematically illustrating a display deviceaccording to another example embodiment.

DETAILED DESCRIPTION

Reference will now be made in detail to example embodiments of which areillustrated in the accompanying drawings, wherein like referencenumerals refer to like elements throughout. In this regard, the exampleembodiments may have different forms and should not be construed asbeing limited to the descriptions set forth herein. Accordingly, theexample embodiments are merely described below, by referring to thefigures, to explain aspects. As used herein, the term “and/or” includesany and all combinations of one or more of the associated listed items.Expressions such as “at least one of,” when preceding a list ofelements, modify the entire list of elements and do not modify theindividual elements of the list. For example, the expression, “at leastone of a, b, and c,” should be understood as including only a, only b,only c, both a and b, both a and c, both b and c, or all of a, b, and c.

The thickness or size of each layer illustrated in the drawings may beexaggerated for convenience of explanation and clarity. In this regard,the example embodiments may have different forms and should not beconstrued as being limited to the descriptions set forth herein.

Hereinafter, when a constituent element is disposed “above” or “on” toanother constituent element, the constituent element may be onlydirectly on the other constituent element or above the other constituentelements in a non-contact manner. The terms such as “comprise” and/or“comprising” may be construed to denote a constituent element, but maynot be construed to exclude the existence of or a possibility ofaddition of another constituent element.

The use of the terms “a” and “an” and “the” and similar referents in thecontext of describing the disclosure are to be construed to cover boththe singular and the plural. Also, operations of all methods describedherein may be performed in any suitable order unless otherwise indicatedherein or otherwise clearly contradicted by context. The presentdisclosure is not limited to the described order of the operations. Theuse of any and all examples, or language (e.g., “such as”) providedherein, is intended merely to better illuminate the disclosure and doesnot pose a limitation on the scope of the disclosure unless otherwiseclaimed.

FIG. 1 is a plan view schematically illustrating a display device 100according to an example embodiment.

Referring to FIG. 1, the display device 100 may include a plurality ofunit pixels 150. For example, the nine unit pixels 150 are illustratedin FIG. 1. Here, in order for the display device 100 to implement acolor image, each of the plurality of unit pixels 150 may include pixels151, 152, and 153 of different colors. For example, each of the unitpixels 150 may include the first pixel 151, a second pixel 152, and athird pixel 153 of different colors. For example, the first pixel 151,the second pixel 152, and the third pixel 153 may be respectively a bluepixel, a green pixel, and a red pixel. However, the first pixel 151, thesecond pixel 152, and the third pixel 153 are not limited thereto.

FIG. 2 is a cross-sectional view taken along a line II-II′ of FIG. 1.

Referring to FIG. 2, the unit pixel 150 may include a substrate 110, atransfer guiding mold 120, and a plurality of micro light emittingdiodes (LEDs) 131, 132, and 133. Here, each of the micro LEDs 131, 132,and 133 may be a light emitting diode that emits light of a specificcolor and is manufactured in the form of a micro chip of a micro size.One surface of each of the micro LEDs 131, 132, and 133 may be providedwith a p-type electrode and an n-type electrode in electrical contactwith a driving circuit 111 that will be described later. Each of themicro LEDs 131, 132, and 133 may constitute one pixel in the displaydevice 100.

The substrate 110 may include, for example, a glass substrate or asilicon substrate. However, this is merely an example and othersubstrates of various materials may be used. The substrate 110 may beprovided with driving circuits 111 for driving the plurality of microLEDs 131, 132, and 133.

The transfer guiding mold 120 may be provided on the upper surface ofthe substrate 110. Here, the transfer guiding mold 120 may be configuredto guide the movement of the micro LEDs 131, 132, and 133 in a processof transferring the micro LEDs 131, 132, and 133 of a specific color tothe substrate 110. To this end, openings 120 a for receiving the microLEDs 131, 132, and 133 may be formed in the transfer guiding mold 120.Here, a portion exposed through the opening 120 a of the transferguiding mold 120 may have an area corresponding to approximately onemicro LED 131, 132, or 133.

The driving circuits 111 provided in the substrate 110 may be exposedthrough the openings 120 a of the transfer guiding mold 120. Thetransfer guiding mold 120 may include, for example, a polymer. Forexample, the transfer guiding mold 120 may include a photoresist.However, this is merely an example. The transfer guiding mold 120 may bemanufactured by, for example, photoresist patterning, etching, molding,or the like, but is not limited thereto.

The plurality of micro LEDs 131, 132, and 133 may be provided on theupper surface of the substrate 110. For example, the plurality of microLEDs 131, 132, and 133 may be provided on the driving circuits 111 ofthe substrate 110 exposed by the openings 120 a of the transfer guidingmold 120. Here, each of the micro LEDs 131, 132, and 133 may be providedsuch that electrodes provided on a lower surface of each of the microLEDs 131, 132, and 133 contact the driving circuit 111.

The plurality of micro LEDs 131, 132, and 133 may include the firstmicro LED 131, the second micro LED 132, and the third micro LED 133that emit light of different wavelength bands. The first micro LED 131may emit light of a color corresponding to the first pixel 151. Forexample, the first micro LED 131 may emit blue light. The second microLED 132 may emit light of a color corresponding to the second pixel 152.For example, the second micro LED 132 may emit green light. The thirdmicro LED 133 may emit light having a color corresponding to the thirdpixel 153. For example, the third micro LED 133 may emit red light.

The plurality of micro LEDs 131, 132, and 133 may be provided insideeach of the openings 120 a of the transfer guiding mold 120. Here, theplurality of micro LEDs 131, 132, and 133 may be provided to be spacedapart from the transfer guiding mold 120. FIG. 3 illustrates an exampleof a plan view illustrating a periphery of the second micro LED 132.Referring to FIG. 3, the second micro LED 132 may be provided inside thetransfer guiding mold 120. Here, the second micro LED 132 may bepositioned to be spaced apart from the transfer guiding mold 120. Inaddition, like the second micro LED 132, the first and third micro LEDs131 and 133 may be positioned to be spaced apart from the transferguiding mold 120 inside the opening 120 a of the transfer guiding mold120.

Referring to FIG. 4, in the example embodiment, a height H2 of thetransfer guiding mold 120 may be smaller than twice a height H1 of themicro LEDs 131, 132, and 133. For example, the height H2 of the transferguiding mold 120 may be about 0.5 to about 1.5 times the height H1 ofthe micro LEDs 131, 132, and 133. However, the height H2 of the transferguiding mold 120 is not limited thereto. As described above, the heightH2 of the transfer guiding mold 120 may be smaller than twice the heightH1 of the micro LEDs 131, 132, and 133 such that the micro LEDs 131,132, and 133 provided at positions away from a target position on thesubstrate 110 after a transfer process may be more easily removed.

In the manufacture of the display device 100, the micro LEDs 131, 132,and 133 of a specific color dispersed in the solution through thetransfer process may be moved to the target position on the substrate110. Here, the micro LEDs 131, 132, and 133 may be more accuratelypositioned at the target position using the transfer guiding mold 120provided on the substrate 110.

When performing the transfer process, the micro LEDs 131, 132, and 133may be positioned in the positions deviated from the target position.For example, the two or more micro LEDs 131, 132, and 133 may overlapeach other inside the opening 120 a of the transfer guiding mold 120. Inthis case, the micro LEDs 131, 132, and 133 positioned above may benecessarily removed after the transfer process. In the exampleembodiment, the height H2 of the transfer guiding mold 120 may be lessthan twice the height H1 of the micro LEDs 131, 132, and 133 such thatthe micro LEDs 131, 132, and 133 positioned at positions away from thetarget position on the substrate 110 may be more easily removed.

FIG. 4 illustrates a display device according to another exampleembodiment. The display device according to the example embodiment hasthe same plane as illustrated in FIG. 1, and a cross section of one unitpixel 250 of the display device is illustrated in FIG. 4.

Referring to FIG. 4, the unit pixel 250 may include a first pixel 252, asecond pixel 252, and a third pixel 253 of different colors. Here, thefirst pixel 251, the second pixel 252, and the third pixel 253 may be,for example, a blue pixel, a green pixel, and a red pixel, respectively.

The unit pixel 250 may include the substrate 110, the transfer guidingmold 120, and the plurality of micro LEDs 131, 132, and 133. Thesubstrate 110 may be provided with the driving circuits 111 for drivingthe plurality of micro LEDs 131, 132, and 133.

The transfer guiding mold 120 may be provided on the upper surface ofthe substrate 110, and the openings 120 a for receiving the micro LEDs131, 132, and 133 may be formed in the transfer guiding mold 120. Thedriving circuits 111 provided on the substrate 110 may be exposedthrough the openings 120 a of the transfer guiding mold 120.

The height H2 of the transfer guiding mold 120 may be less than twicethe height H1 of the micro LEDs 131, 132, and 133. For example, theheight H2 of the transfer guiding mold 120 may be about 0.5 to about 1.5times the height H1 of the micro LEDs 131, 132, and 133, but is notlimited thereto. A concave-convex structure 125 may be provided on theupper surface of the transfer guiding mold 120. The concave-convexstructure 125 may be configured to more easily remove the unnecessarymicro LEDs 131, 132, and 133 remaining on the upper surface of thetransfer guiding mold 120 a after a transfer process, as describedbelow.

The plurality of micro LEDs 131, 132, and 133 may be provided on theupper surface of the substrate 110. For example, the plurality of microLEDs 131, 132, and 133 may be provided on the driving circuits 111 ofthe substrate 110 exposed by the openings 120 a of the transfer guidingmold 120. The plurality of micro LEDs 131, 132, and 133 may respectivelyinclude the first, second, and third micro LEDs 131, 132, 133 that emitlight of different wavelength bands. For example, the first, second, andthird micro LEDs 131, 132, and 133 may respectively emit light of colorscorresponding to the first pixel 251, the second pixel 252, and thethird pixel 253. The transfer guiding mold 120 may be provided tosurround a periphery of the plurality of micro LEDs 131, 132, and 133.Here, the plurality of micro LEDs 131, 132, and 133 may be provided tobe spaced apart from the transfer guiding mold 120.

In the example embodiment, the concave-convex structure 125 may beformed on the upper surface of the transfer guiding mold 120, such thatthe micro LEDs 131, 132, and 133 present on the upper surface of thetransfer guiding mold 120 may be more effectively removed after thetransfer process. Also, the height H2 of the transfer guiding mold 120may be less than twice the height H1 of the micro LEDs 131, 132, and133, such that the micro LEDs 131, 132, and 133 provided at positionsaway from a target position inside opening 120 a of the transfer guidingmold 120 may be more easily removed.

FIG. 5 illustrates a display device according to another exampleembodiment. The display device according to the example embodiment hasthe same plane as that shown in FIG. 1, and a cross section of one unitpixel 350 of the display device is illustrated in FIG. 5.

Referring to FIG. 5, the unit pixel 350 may include a first pixel 351, asecond pixel 352, and a third pixel 353 of different colors. Here, thefirst pixel 351, the second pixel 352, and the third pixel 353 may be,respectively, for example, a blue pixel, a green pixel, and a red pixel.

The unit pixel 350 may include the substrate 110 provided with thedriving circuits 111, a transfer guiding mold 320 provided on thesubstrate 110, the plurality of micro LEDs 131, 132, and 133 provided onthe substrate 110, and a reflective layer 341 provided in the transferguiding mold 320.

The transfer guiding mold 320 may be provided on the upper surface ofthe substrate 110, and openings 320 a for receiving the micro LEDs 131,132, and 133 may be formed in the transfer guiding mold 320. The drivingcircuits 111 provided on the substrate 110 may be exposed through theopenings 320 a of the transfer guiding mold 320. Here, a portion exposedby the opening 320 a of the transfer guiding mold 320 may have an areacorresponding to approximately one micro LED 131, 132, or 133.

The height H2 of the transfer guiding mold 320 may be less than twicethe height H1 of the micro LEDs 131, 132, and 133. For example, theheight H2 of the transfer guiding mold 320 may be about 0.5 to about 1.5times the height H1 of the micro LEDs 131, 132, and 133, but is notlimited thereto. The upper surface of the transfer guiding mold 320 maybe provided with the concave-convex structure 125 as illustrated in FIG.4 as described above.

The plurality of micro LEDs 131, 132, and 133 may be provided on thedriving circuits 111 of the substrate 110 exposed by the openings 320 aof the transfer guiding mold 320. The plurality of micro LEDs 131, 132,and 133 may respectively include the first, second, and third micro LEDs131, 132, and 133 that emit light of different wavelength bands. Thefirst, second, and third micro LEDs 131, 132, and 133 may emit light ofcolors corresponding to the first pixel 351, the second pixel 352, andthe third pixel 353.

The plurality of micro LEDs 131, 132, and 133 may be provided insideeach of the openings 320 a of the transfer guiding mold 320. Here, theplurality of micro LEDs 131, 132, and 133 may be provided to be spacedapart from the transfer guiding mold 320. FIG. 6 illustrates an exampleof a plan view illustrating a periphery of the second micro LED 132.Referring to FIG. 6, the second micro LED 132 may be provided inside thetransfer guiding mold 320. Here, the second micro LED 132 may bepositioned to be spaced apart from the transfer guiding mold 320. Inaddition, like the second micro LED 132, the first micro LED 131 and thethird micro LED 133 may be positioned to be spaced apart from thetransfer guiding mold 320 inside the opening 320 a of the transferguiding mold 320.

The reflective layer 341 may be provided in the transfer guiding mold320 between the plurality of micro LEDs 131, 132, and 133. Specifically,a groove 320 b of a predetermined depth may be formed in the transferguiding mold 320 between the plurality of micro LEDs 131, 132, and 133,and the reflective layer 341 may be provided on the inner wall of thegroove 320 b.

The reflective layer 341 may be provided to surround each of theplurality of micro LEDs 131, 132, and 133. Referring to FIG. 6, thereflective layer 341 may be provided in the transfer guiding mold 320 ato surround the second micro LED 132. In addition, the reflective layer341 may be provided to surround each of the first micro LED 131 and thethird micro LED 133. The reflective layer 341 may include a metalmaterial. For example, the reflective layer 341 may include aluminum(Al), silver (Ag), and the like, but is not limited thereto.

The reflective layer 341 may be configured to prevent or reduce mixingof light of different colors emitted from the adjacent pixels 351, 352,and 353. For example, light of a predetermined color emitted from thesecond micro LED 132 constituting the second pixel 352 may be reflectedby the reflective layer 341 provided in the transfer guiding mold 320 tosurround the second micro LED 132. Accordingly, the light of thepredetermined color emitted from the second micro LED 132 may beprevented from traveling toward the adjacent first pixel 351 and thirdpixel 353. Thus, crosstalk between the adjacent pixels 351, 352 and 353may be prevented or reduced from occurring.

In the example embodiment, the height H2 of the transfer guiding mold320 may be less than twice the height H1 of the micro LEDs 131, 132, and133 such that the micro LEDs 131, 132, and 133 provided at positionsaway from a target position on the substrate 110 may be more easilyremoved. In addition, when a concave-convex structure is formed on theupper surface of the transfer guiding mold 320, the micro LEDs 131, 132,and 133 provided on the upper surface of the transfer guiding mold 320may be more effectively removed after the transfer process. Thereflective layer 341 may be provided in the transfer guiding mold 320between the plurality of micro LEDs 131, 132, and 133, and thuscrosstalk between the adjacent pixels 351, 352, and 353 may be preventedor reduced from occurring.

FIG. 7 illustrates a display device according to another exampleembodiment. The display device according to the example embodiment hasthe same plane as that shown in FIG. 1, and a cross section of one unitpixel 450 of the display device is illustrated in FIG. 7.

Referring to FIG. 7, the unit pixel 450 may include a first pixel 451, asecond pixel 452, and a third pixel 453 of different colors. Here, thefirst pixel 451, the second pixel 452, and the third pixel 453 may berespectively, for example, a blue pixel, a green pixel, and a red pixel.

The unit pixel 450 may include the substrate 110 provided with thedriving circuits 111, a transfer guiding mold 420 provided on thesubstrate 110, the plurality of micro LEDs 131, 132, and 133 provided onthe substrate 110, and a reflective layer 442 provided on the transferguiding mold 420.

Openings 420 a for receiving the micro LEDs 131, 132, and 133 may beformed in the transfer guiding mold 420. The driving circuits 111provided on the substrate 110 may be exposed through the openings 420 aof the transfer guiding mold 420. Here, a portion exposed by the opening420 a of the transfer guiding mold 420 may have an area corresponding toapproximately one micro LED 131, 132, or 133.

The height H2 of the transfer guiding mold 420 may be less than twicethe height H1 of the micro LEDs 131, 132, and 133. For example, theheight H2 of the transfer guiding mold 420 may be about 0.5 to about 1.5times the height H1 of the micro LEDs 131, 132, and 133, but is notlimited thereto. The upper surface of the transfer guiding mold 420 maybe provided with the above-described concave-convex structure 125 asillustrated in (FIG. 4).

The plurality of micro LEDs 131, 132, and 133 may be provided in thedriving circuits 111 of the substrate 110 exposed by the openings 420 aof the transfer guiding mold 420. The plurality of micro LEDs 131, 132,and 133 may respectively include the first, second, and third micro LEDs131, 132, and 133 that emit light of different wavelength bands. Thefirst micro LED 131, the second micro LED 132, and the third micro LED133 may respectively emit light of colors corresponding to the firstpixel 351, the second pixel 352, and the third pixel 353.

The plurality of micro LEDs 131, 132, and 133 may be provided insideeach of the openings 420 a of the transfer guiding mold 420. Here, theplurality of micro LEDs 131, 132, and 133 may be provided to be spacedapart from the transfer guiding mold 420. FIG. 8 illustrates an exampleof a plan view illustrating a periphery of the second micro LED 132.Referring to FIG. 8, the second micro LED 132 may be provided inside thetransfer guiding mold 420. Here, the second micro LED 132 may bepositioned to be spaced apart from the transfer guiding mold 420. Inaddition, like the second micro LED 132, the first micro LED 131 and thethird micro LED 133 may be positioned to be spaced apart from thetransfer guiding mold 420 inside the opening 420 a of the transferguiding mold 420.

The reflective layer 442 may be provided in the transfer guiding mold420. For example, the reflective layer 442 may be provided on the innerwall of each of the openings 420 a of the transfer guiding mold 420.Here, the reflective layer 442 may be provided to surround each of theplurality of micro LEDs 131, 132, and 133. Referring to FIG. 8, thereflective layer 442 may be provided in the transfer guiding mold 420 tosurround the second micro LED 132. In addition, the reflective layer 442may be provided to surround each of the first and third micro LEDs 131and 133. The reflective layer 442 may include a metal material. Forexample, the reflective layer 442 may include Al, Ag, and the like, butis not limited thereto.

The reflective layer 442 may serve to prevent or reduce mixing of lightof different colors emitted from the adjacent pixels 451, 452, and 453.Specifically, for example, light of a predetermined color emitted fromthe second micro LED 132 constituting the second pixel 452 may bereflected by the reflective layer 442 provided on the inner wall of theopening 420 a of the opening guiding mold 420 to surround the secondmicro LED 132. Thus, the light of the predetermined color emitted fromthe second micro LED 132 may be prevented or reduced from travelingtoward the adjacent first pixel 451 and the third pixel 453, and thuscrosstalk between the adjacent pixels 451, 452 and 453 may be preventedor reduced from occurring.

In the example embodiment, the height H2 of the transfer guiding mold420 may be less than twice the height H1 of the micro LEDs 131, 132, and133 such that the micro LEDs 131, 132, and 133 provided at positionsaway from a target position on the substrate 110 may be more easilyremoved. In addition, when a concave-convex structure is formed on theupper surface of the transfer guiding mold 420, the micro LEDs 131, 132,and 133 provided on the upper surface of the transfer guiding mold 420may be more effectively removed after a transfer process. In addition,the reflective layer 442 may be provided on the inner wall of theopening 420 a of the transfer guiding mold 420, and thus crosstalkbetween the adjacent pixels 451, 452, and 453 may be prevented orreduced from occurring.

FIG. 9 illustrates a display device according to another exampleembodiment. The display device according to the example embodiment hasthe same plane as that shown in FIG. 1, and a cross section of one unitpixel 550 of the display device is illustrated in FIG. 9.

Referring to FIG. 9, the unit pixel 550 may include a first pixel 551, asecond pixel 552, and a third pixel 553 of different colors. Here, thefirst pixel 551, the second pixel 552, and the third pixel 553 may berespectively, for example, a blue pixel, a green pixel, and a red pixel.

The unit pixel 550 may include the substrate 110 provided with thedriving circuits, a transfer guiding mold 520 provided on the substrate110, the plurality of micro LEDs 131, 132, and 133 provided on thesubstrate 110, and first reflective layer 541 and the second reflectivelayer 542 provided on the transfer guiding mold 520.

Openings 520 a for receiving the micro LEDs 131, 132, and 133 may beformed in the transfer guiding mold 520. The driving circuits 111provided on the substrate 110 may be exposed through the openings 520 aof the transfer guide mold 520.

The height H2 of the transfer guiding mold 520 may be less than twicethe height H1 of the micro LEDs 131, 132, and 133. For example, theheight H2 of the transfer guiding mold 520 may be about 0.5 to about 1.5times the height H1 of the micro LEDs 131, 132, and 133, but is notlimited thereto. The upper surface of the transfer guiding mold 520 maybe provided with the above-described concave-convex structure 125 asillustrated in FIG. 4.

The plurality of micro LEDs 131, 132, and 133 may be provided on thedriving circuits 111 of the substrate 110 exposed by the openings 520 aof the transfer guiding mold 520. The plurality of micro LEDs 131, 132,and 133 may respectively include the first micro LED 131, the secondmicro LED 132, and the third micro LED 133 that emit light of differentwavelength bands. The first micro LED 131, the second micro LED 132, andthe third micro LED 133 may emit light of colors corresponding to thefirst pixel 551, the second pixel 552, and the third pixel 553.

The plurality of micro LEDs 131, 132, and 133 may be provided insideeach of the openings 520 a of the transfer guiding mold 520. Here, theplurality of micro LEDs 131, 132, and 133 may be provided to be spacedapart from the transfer guiding mold 520.

The first reflective layer 541 may be provided in the transfer guidingmold 520 between the plurality of micro LEDs 131, 132, and 133. Forexample, a groove 520 b of a predetermined depth may be formed in thetransfer guiding mold 520 between the plurality of micro LEDs 131, 132,and 133, and the first reflective layer 541 may be provided on the innerwall of the groove 520 b. The first reflective layer 541 may be providedto surround each of the plurality of micro LEDs 131, 132, and 133. Thefirst reflective layer 541 may include, for example, a metal materialsuch as Al, Ag, or the like.

The second reflective layer 542 may be provided on the inner wall ofeach of the openings 520 a of the transfer guiding mold 520. Here, thesecond reflective layer 542 may be provided to surround each of theplurality of micro LEDs 131, 132, and 133. The second reflective layer542 may include a metal material similar to the first reflective layer541. The first reflective layer 541 and the second reflective layer 542may more effectively prevent or reduce crosstalk between the adjacentpixels 551, 552, and 553 from occurring.

In the example embodiment, the height H2 of the transfer guiding mold520 may be less than twice the height H1 of the micro LEDs 131, 132, and133 such that the micro LEDs 131, 132, and 133 provided at positionsaway from a target position on the substrate 110 may be more easilyremoved. In addition, when a concave-convex structure is formed on theupper surface of the transfer guiding mold 520, the micro LEDs 131, 132,and 133 provided on the upper surface of the transfer guiding mold 520may be more effectively removed after a transfer process. In addition,the first reflective layer 541 and the second reflective layer 542 maybe provided in the transfer guiding mold 520, and thus crosstalk betweenthe adjacent pixels 551, 552, and 553 may be more effectively preventedor reduced from occurring.

FIG. 10 illustrates a display device according to another exampleembodiment. The display device according to the example embodiment hasthe same plane as that shown in FIG. 1, and a cross section of one unitpixel 650 of the display device is illustrated in FIG. 10.

Referring to FIG. 10, the unit pixel 650 may include a first pixel 651,a second pixel 652, and a third pixel 653 of different colors. Here, thefirst pixel 651, the second pixel 652, and the third pixel 653 may berespectively, for example, a blue pixel, a green pixel, and a red pixel.

The substrate 110 may be provided with the driving circuits 111 fordriving a plurality of micro LEDs 631, 632, and 633. The substrate 110may include, for example, a glass substrate or a silicon substrate, butis not limited thereto.

A transfer guiding mold 620 may be provided on the upper surface of thesubstrate 110. Here, openings 620 a for receiving the micro LEDs 631,632, and 633 may be formed in the transfer guiding mold 620. The drivingcircuits 111 provided on the substrate 110 may be exposed through theopenings 620 a of the transfer guide mold 620. Here, a portion exposedby the opening 620 a of the transfer guiding mold 620 may have an areacorresponding to approximately one micro LED 631, 632, or 633.

The height H2 of the transfer guiding mold 620 may be less than twicethe height H1 of the micro LEDs 631, 632, and 633. For example, theheight H2 of the transfer guiding mold 620 may be about 0.5 to about 1.5times the height H1 of the micro LEDs 631, 632 and 633, but is notlimited thereto. A concave-convex structure may be provided on the uppersurface of the transfer guiding mold 620.

The plurality of micro LEDs 631, 632, and 633 may be provided on thesubstrate 110, for example, on the driving circuits 111 exposed by theopenings 620 a of the transfer guiding mold 620. The plurality of microLEDs 631, 632 and 633 may be provided to be spaced apart from thetransfer guiding mold 620 inside each of the openings 620 a of thetransfer guiding mold 620.

In the example embodiment, the plurality of micro LEDs 631, 632, and 633may respectively include the first micro LED 631, the second micro LED632, and the third micro LED 633 which emit light of the same wavelengthband. Here, the first micro LED 631, the second micro LED 632, and thethird micro LED 633 may be respectively provided to correspond to thefirst pixel 651, the second pixel 652, and the third pixel 653. Forexample, the first, second, and third micro LEDs 631, 632, and 633 mayemit light of a first color, for example, blue light.

A first reflective layer 641 may be provided in the transfer guidingmold 620 between the micro LEDs 631, 632, and 633. For example, a groove620 b of a predetermined depth may be formed in the transfer guidingmold 620 between the plurality of micro LEDs 631, 632 and 633, and thefirst reflective layer 641 may be provided on the inner wall of thegroove 620 b. The first reflective layer 641 may be provided to surroundeach of the plurality of micro LEDs 631, 632, and 633. The firstreflective layer 641 may include, for example, a metal material such asAl, Ag, or the like. A reflective layer may be provided on the innerwall of the opening 620 a of the transfer guiding mold 620.

A filling layer 665 may be provided in the opening 620 a of the transferguiding mold 620 to fill the micro LEDs 631, 632, and 633. Here, thefilling layer 665 may include a material that transmits light emittedfrom the micro LEDs 631, 632 and 633.

A transparent material layer 670 may be provided on the first micro LED631 provided to correspond to the first pixel 651. In addition, abarrier 660 that receives the transparent material layer 670 may beprovided on the upper portion of the transfer guiding mold 620surrounding the first micro LED 631. The barrier 660 may include thesame material as the filling layer 665 described above, but is notlimited thereto. A second reflective layer 685 may be provided on theinner wall of the barrier 660. The second reflective layer 685 mayinclude, for example, a metal material, such as Al or Ag, similar to thefirst reflective layer 641, but is not limited thereto. Light of a firstcolor, for example, blue light emitted from the first micro LED 631 maypass through the transparent material layer 670 and may be emitted fromthe first pixel 651.

A first photoconversion material layer 672 may be provided on the upperportion of the second micro LED 632 provided to correspond to the secondpixel 652. Here, the first photoconversion material layer 672 mayconvert the wavelength of an incident light. Specifically, the firstphotoconversion material layer 672 may convert the light of the firstcolor, for example, blue light emitted from the second micro LED 632into light of a second color, for example, green light. The firstphotoconversion material layer 672 may include, but is not limited to,for example, quantum dots (QDs).

The barrier 660 that receives the first photoconversion material layer672 may be provided on the upper portion of the transfer guiding mold620 surrounding the second micro LED 632. In addition, theaforementioned second reflective layer 685 may be provided on the innerwall of the barrier 660. The light of the first color, for example, bluelight emitted from the second micro LED 632 may be converted into thelight of the second color, for example, green light by the firstphotoconversion material layer 672, and thus emitted from the secondpixel 652.

A second photoconversion material layer 673 may be provided on the upperportion of the third micro LED 633 provided to correspond to the thirdpixel 653. Here, the second photoconversion material layer 673 mayconvert the wavelength of the incident light. For example, the secondphotoconversion material layer 673 may convert the light of the firstcolor, for example, blue light emitted from the third micro LED 633 intolight of a third color, for example, red light. The secondphotoconversion material layer 673 may include, but is not limited to,for example, QDs.

The barrier 660 that receives the second photoconversion material layer673 may be provided on the upper portion of the transfer guiding mold620 surrounding the third micro LED 633. In addition, the aforementionedsecond reflective layer 685 may be provided on the inner wall of thebarrier 660. The light of the first color, for example, blue lightemitted from the third micro LED 633 may be converted into the light ofthe third color, for example, red light by the second photoconversionmaterial layer 673, and thus emitted from the third pixel 653.

The height H3 of the barrier 660 provided on the upper portion of thetransfer guiding mold 620 to more effectively convert the firstphotoconversion material layer 672 and the second photoconversionmaterial layer 673 received by the barrier 660 may be greater than theheight H2 of the transfer guiding mold 620.

In the example embodiment, the height H2 of the transfer guiding mold620 may be less than twice the height H1 of the micro LEDs 631, 632 and633 such that the micro LEDs 631, 632 and 633 provided at positions awayfrom a target position on the substrate 110 may be more easily removed.In addition, the first reflective layer 641 and the second reflectivelayer 685 may be provided in the transfer guiding mold 620 and thebarrier 660, and thus crosstalk between the adjacent pixels 651, 652,and 653 may be more effectively prevented or reduced from occurring.

FIG. 11 illustrates a display device according to another exampleembodiment. The display device according to the example embodiment hasthe same plane as shown in FIG. 1, and a cross section of one unit pixel750 of the display device is illustrated in FIG. 11.

Referring to FIG. 11, the unit pixel 750 may include a first pixel 751,a second pixel 752, and a third pixel 753 of different colors. Here, thefirst pixel 751, the second pixel 752, and the third pixel 753 may berespectively, for example, a blue pixel, a green pixel, and a red pixel.

The substrate 110 may be provided with the driving circuits 111 fordriving a plurality of micro LEDs 731, 732, and 733, and a transferguiding mold 720 may be provided on the upper surface of the substrate110. Openings 720 a for receiving the micro LEDs 731, 732, and 733 maybe formed in the transfer guiding mold 720, and the driving circuits 111provided on the substrate 110 may be exposed through the openings 720 a.

The height of the transfer guiding mold 720 may be less than twice theheight of the micro LEDs 731, 732, and 733. For example, the height ofthe transfer guiding mold 720 may be about 0.5 to about 1.5 times theheight of the micro LEDs 731, 732 and 733, but is not limited thereto. Aconcave-convex structure may be provided on the upper surface of thetransfer guiding mold 720.

The plurality of micro LEDs 731, 732, and 733 may be provided on thedriving circuits 111 of the substrate 110 exposed by the openings 720 aof the transfer guiding mold 720. The plurality of micro LEDs 731, 732,and 733 may be provided to be spaced apart from the transfer guidingmold 720 inside each of the openings 720 a of the transfer guiding mold720.

In the example embodiment, the plurality of micro LEDs 731, 732, and 733may respectively include the first micro LED 731, the second micro LED732, and the third micro LED 733 that emit light of the same wavelengthband. The first micro LED 731, the second micro LED 732, and the thirdmicro LED 733 may be provided to correspond to the first, second, andthird pixels 751, 752, and 753 respectively. The first micro LED 731,the second micro LED 732, and the third micro LED 733 may emit, forexample, ultraviolet light.

A first guiding layer 741 may be provided in the transfer guiding mold720 between the plurality of micro LEDs 731, 732, and 733. For example,a groove 720 b of a predetermined depth may be formed in the transferguiding mold 720 between the plurality of micro LEDs 731, 732, and 733,and the first guiding layer 741 may be provided on the inner wall of thegroove 720 b. A reflective layer may be provided on the inner wall ofthe opening 720 a of the transfer guiding mold 720. A filling layer 765may be provided inside the opening 720 a of the transfer guiding mold720 to fill the micro LEDs 731, 732, and 733. Here, the filling layer765 may include a material that transmits light emitted from the microLEDs 731, 732, and 733.

A first photoconversion material layer 771 may be provided on the upperportion of the first micro LED 731 provided to correspond to the firstpixel 751. Here, the first photoconversion material layer 771 mayconvert the wavelength of incident light. For example, the firstphotoconversion material layer 771 may convert light of a predeterminedwavelength, for example, ultraviolet light emitted from the first microLED 731 into light of a first color, for example, blue light. The firstphotoconversion material layer 771 may include, but is not limited to,for example, QDs.

A barrier 760 for receiving the first photoconversion material layer 771may be provided on the upper portion of the transfer guiding mold 720surrounding the first micro LED 731. A second reflective layer 785 maybe provided on the inner wall of the barrier 760. The second reflectivelayer 785 may include, for example, a metal material, such as Al or Ag,like the first reflective layer 741, but is not limited thereto. Thelight of the predetermined wavelength emitted from the first micro LED731, for example, ultraviolet rays may be converted into the light ofthe first color, for example, blue light by the first photoconversionmaterial layer 771, and thus emitted from the first pixel 751.

A second photoconversion material layer 772 may be provided on the upperportion of the second micro LED 732 provided to correspond to the secondpixel 752. Here, the second photoconversion material layer 772 mayconvert the wavelength of the incident light. For example, the secondphotoconversion material layer 772 may convert light of a predeterminedwavelength, for example, ultraviolet light emitted from the second microLED 732 into light of a second color, for example, green light. Thesecond photoconversion material layer 772 may include, but is notlimited to, for example, QDs.

The barrier 760 for receiving the second photoconversion material layer772 may be provided on the upper portion of the transfer guiding mold720 surrounding the second micro LED 732. In addition, theaforementioned second reflective layer 785 may be provided on the innerwall of the barrier 760. The light of the predetermined wavelength, forexample, ultraviolet light emitted from the second micro LED 732 may beconverted into the light of the second color, for example, green lightby the second photoconversion material layer 772, and thus may beemitted from the second pixel 752.

A third photoconversion material layer 773 may be provided on the upperportion of the third micro LED 733 provided to correspond to the thirdpixel 753. Here, the third photoconversion material layer 773 mayconvert the wavelength of incident light. For example, the thirdphotoconversion material layer 773 may convert light of a predeterminedwavelength, for example, ultraviolet light emitted from the third microLED 733 into light of a third color, for example, red light. The thirdphotoconversion material layer 773 may include, but is not limited to,for example, QDs.

The barrier 760 for receiving the third photoconversion material layer773 may be provided on the upper portion of the transfer guiding mold720 surrounding the third micro LED 733. In addition, the aforementionedsecond reflective layer 785 may be provided on the inner wall of thebarrier 760. The light of the predetermined wavelength, for example,ultraviolet light emitted from the third micro LED 733 may be convertedinto the light of the third color, for example, red light by the thirdphotoconversion material layer 773 and thus emitted from the third pixel753.

The height of the barrier 760 provided on the upper portion of thetransfer guiding mold 720 in order for the first photoconversionmaterial layer 771, the second photoconversion material layer 772, andthe third photoconversion material layer 773 received by the barrier 760to more effectively convert the incident light may be greater than theheight of the transfer guiding mold 720.

In the example embodiment, the height of the transfer guiding mold 720may be less than twice the height of the micro LEDs 731, 732, and 733such that the micro LEDs 731, 732, and 733 provided at positions awayfrom a target position on the substrate 110 may be more easily removed.In addition, the first reflective layer 741 and the second reflectivelayer 785 may be provided in the transfer guiding mold 720 and thebarrier 760, and thus crosstalk between the adjacent pixels 751, 752,and 753 may be more effectively prevented or reduced from occurring.

In the above-described example embodiments, it is described that theunit pixel of the display device includes a plurality of pixels ofdifferent colors, for example, first pixel, the second pixel, and thethird pixel of different colors. Here, one unit pixel includes only onepixel of the same color. However, the embodiments are not limitedthereto, and two or more pixels of the same color may be included in oneunit pixel.

FIG. 12 is a plan view schematically illustrating a display device 800according to another example embodiment.

Referring to FIG. 12, the display apparatus 800 may include a pluralityof unit pixels 850. In FIG. 1, for example the 6 unit pixels 850 areillustrated. Here, each of the plurality of unit pixels 850 may includepixels 851, 852, and 853 of different colors. For example, each of theunit pixels 850 may include first pixel 851, a second pixel 852, and athird pixel 853 of different colors. Here, may have the same structureas first pixel, the second pixel, and the third pixel described in theabove-described example embodiments. Thus, detailed descriptions thereofwill be omitted.

In the example embodiment, the unit pixel 850 may include two pixels ofthe same color. For example, the unit pixel 850 may include two firstpixels 851, two second pixels 852, and two third pixels 853. Here, thefirst pixel 851, the second pixel 852, and the third pixel 853 may berespectively, for example, a blue pixel, a green pixel, and a red pixel.

As described above, when the unit pixel 850 includes the two pixels 851,852 and 853 of the same color, and thus a color image may be normallyimplemented without having to repair a defective pixel even when any oneof the two pixels 851, 852 and 853 of the same color is defective.

The case in which the unit pixel 850 includes the two pixels 851, 852,and 853 of the same color is described as an example, but is not limitedthereto. The unit pixel 850 may include three or more pixels of the samecolor.

According to the display device according to the example embodimentdescribed above, the height of a transfer guiding mold that guidestransfer of a plurality of micro LEDs may be less than twice the heightof the micro LEDs such that the micro LEDs provided at positions awayfrom a target position on a substrate may be more easily removed. Inaddition, a concave-convex structure may be formed on the surface of thetransfer guiding mold, and thus the micro LEDs remaining on the surfaceof the transfer guiding mold may be more easily removed. A reflectivelayer may be provided on the transfer guiding mold, and thus crosstalkbetween adjacent pixels may be effectively prevented or reduced fromoccurring.

Although the example embodiments have been described above, the presentdisclosure is not limited thereto, and various modifications may be madeby those skilled in the art.

It should be understood that example embodiments described herein shouldbe considered in a descriptive sense only and not for purposes oflimitation. Descriptions of features or aspects within each exampleembodiment should typically be considered as available for other similarfeatures or aspects in other embodiments.

While example embodiments have been described with reference to thefigures, it will be understood by those of ordinary skill in the artthat various changes in form and details may be made therein withoutdeparting from the spirit and scope as defined by the following claims.

What is claimed is:
 1. A display device comprising: a substrate; atransfer guiding mold provided on the substrate and comprising aplurality of openings; a plurality of micro light emitting diodes (LEDs)provided on the substrate in the plurality of openings, wherein thetransfer guiding mold is configured to guide a movement of the microLEDs in a process of transferring the micro LEDs of the substrate,wherein a height of the transfer guiding mold is less than twice aheight, but greater than a single height, of each of the plurality ofmicro LEDs.
 2. The display device of claim 1, further comprising aplurality of driving circuits configured to drive the plurality of microLEDs, respectively, wherein each of the plurality of driving circuitsare provided on the substrate and a portion of each of the plurality ofdriving circuits are exposed through the plurality of openings,respectively, of the transfer guiding mold.
 3. The display device ofclaim 1, wherein the plurality of micro LEDs are provided to be spacedapart from the transfer guiding mold.
 4. The display device of claim 1,further comprising a first reflective layer provided on the transferguiding mold between the plurality of micro LEDs.
 5. The display deviceof claim 1, further comprising a second reflective layer provided on aninner wall of an opening provided in the transfer guiding mold.
 6. Thedisplay device of claim 1, further comprising a concave-convex structureprovided on an upper surface of the transfer guiding mold.
 7. Thedisplay device of claim 1, further comprising a plurality of unit pixelseach comprising a plurality of pixels of different colors.
 8. Thedisplay device of claim 7, wherein each of the plurality of unit pixelscomprises two or more pixels of a same color.
 9. The display device ofclaim 7, wherein the plurality of pixels of different colors comprises aplurality of micro LEDs configured to emit light of different wavelengthbands.
 10. The display device of claim 7, wherein the plurality ofpixels of different colors comprises a plurality of micro LEDsconfigured to emit light of a same wavelength band, and at least some ofthe plurality of micro LEDs are provided with a photoconversion materiallayer configured to convert a wavelength of an incidence light.
 11. Thedisplay device of claim 10, further comprising a barrier provided on anupper portion of the transfer guiding mold, the barrier being configuredto receive the photoconversion material layer.
 12. The display device ofclaim 11, further comprising a reflective layer provided on an innerwall of the barrier.
 13. The display device of claim 11, wherein aheight of the barrier is greater than the height of the transfer guidingmold.